JPH0167080U - - Google Patents
Info
- Publication number
- JPH0167080U JPH0167080U JP1987161840U JP16184087U JPH0167080U JP H0167080 U JPH0167080 U JP H0167080U JP 1987161840 U JP1987161840 U JP 1987161840U JP 16184087 U JP16184087 U JP 16184087U JP H0167080 U JPH0167080 U JP H0167080U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring terminal
- dam
- sealed structure
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161840U JPH0167080U (en]) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161840U JPH0167080U (en]) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167080U true JPH0167080U (en]) | 1989-04-28 |
Family
ID=31445130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161840U Pending JPH0167080U (en]) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167080U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123808A (ja) * | 2000-10-16 | 2002-04-26 | Dainippon Printing Co Ltd | 接触型非接触型共用ｉｃモジュール、および、それを用いたｉｃカード |
-
1987
- 1987-10-22 JP JP1987161840U patent/JPH0167080U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123808A (ja) * | 2000-10-16 | 2002-04-26 | Dainippon Printing Co Ltd | 接触型非接触型共用ｉｃモジュール、および、それを用いたｉｃカード |
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